作者: gyseven () 看板: Tech_Job
標題: [課程] Key Enabling Technologies for 3D IC / Si Integrations
時間: Sat Jun 2 10:17:33 2012
101年通訊與資訊軟體技術人才培訓計畫
Key Enabling Technologies for 3D IC / Si Integrations
特別聘請 工研院電光所 劉漢誠 John H. Lau 博士
( ITRI Fellow of ITRI since 2010... )
(講師介紹)
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H. Lau博士目前受聘於工業技術研究院，他已經在電子、光電和汽車產業，從事研發、
製造的工作超過30年了，編寫或是合著的評論性技術文章超過250篇，撰寫的書籍超過
100多個章節，同時舉行或受邀參加過230場專題研討會和演講，自1986年起，在IEEE、
ASME、IPC、SMTA、ASM、NEPCON以及APEX教授電子、光電封裝等課程，深獲許多知名
企業的工程師與經理人好評。 John Lau博士簡歷如下:
ITRI Fellow of Industrial Technology Research Institute since January 2010.
The visiting professor at Hong Kong University Science & Technology for one
year.
*The Director of Microsystems, Modules & Components (MMC) Laboratory with
Institute of Microelectronics in Singapore for 2 years.
*The senior Scientist/MTS at HP/Agilent in US for more than 25 years.
*ASME Fellow.
*IEEE Fellow since 1994.
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課程大綱
The key enabling technologies for 3D IC integration are, e.g., electrical,
thermal, and mechanical designs and tests, known good die (KGD), TSV
(through silicon via) forming and filling, wafer thinning and handling,
thin chip strength measurement and improving, lead-free microbump forming
and assembly, low temperature C2W and W2W bonding, and thermal management.
In this course, all these enabling technologies (except electrical)
will be discussed.
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建議之學生背景:
If you (students, engineers, and managers) are involved with any aspect of
the electronics industry, you should attend this course. It is equally
suited for R&D personals and scientists.
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授課時間 6/9、6/16 9：00∼19：00(中間休息1.5HR，附午、晚餐)
授課地點 工程四館824
授課時數及課程費用 優惠價4500元(三人以上團報、舊學員、交大校友九折)
優惠價報名截止日 2011-06-09 截止
線上報名: http://tinyurl.com/7xk2ubg
歡迎點閱更多課程資訊:http://tinyurl.com/6tu7ydw
報名請洽:
EMAIL: nctucnc@gmail.com
電 話:03-5131450 曾小姐
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◆ From: 140.113.13.152
※ 編輯: gyseven 來自: 140.113.13.152 (06/02 10:20)
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